Company Description

Join SEAKR Engineering, a leading-edge provider of advanced electronics for space applications. Pushing the boundaries of technology on a mission to change the world for the better from space.

Job Description

Seeking a mechanical engineer with knowledge of electronics packaging design, thermal analysis, and dynamics experience to assist in designing aerospace electronics systems.

• Candidate will be responsible for leading the mechanical design of flight electronics systems, including the mechanical design of the flight chassis and CCAs
• Experience with printed circuit board design, high reliability thermal management and electronics manufacturing techniques is required
• Experience with Solidworks is a plus
• Clear written and verbal communication skills are required
• Must have demonstrated electronics packaging design experience for high reliability systems
• Must have working knowledge of thermal management techniques for aerospace
• Ability to mentor junior engineers
• Responsible for mechanical packaging design of aerospace electronics, including the chassis and printed circuit boards
• Lead other mechanical engineers in the mechanical design
• Responsible for coordination with other disciplines at SEAKR, including PCB design, Electrical Engineering, and manufacturing
• Responsible for defending designs at internal and external design reviews

Qualifications

Candidate shall have a Bachelor’s degree or higher in Mechanical Engineering or equivalent and at least 8 years of experience.

Additional Information

Compensation: Base salary range is $130,000-165,000 , depending on qualifications. SEAKR has very rich medical, dental and vision insurance plans, along with a generous 401(k) retirement plan. In addition to base salary, employees are eligible for a year-end bonus. SEAKR offers a variety of paid leave, such as vacation, sick, bereavement, and FMLA. 

SEAKR is an Equal Opportunity Employer - All your information will be kept confidential according to EEO guidelines. 

US Citizenship Required

Applications will be accepted until 5/28/26.