About GlobalFoundries: 

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. 

Summary of Role: 

This hands-on Package and chip assembly Engineering role will develop industry leading advanced packaging utilizing assembly techniques to enable 2.5D and 3D packaging for world leading photonic products. The candidate will bring a strong focus on one or multiple of the many assembly technologies required - Wafer level processing for TSV's, RDL, and bumping, advanced flip chip on chip and chip on wafer assembly, Wafer singulation, and chip to package assembly. Target candidates would include development engineers for - A variety of Assembly Processes, Assembly Equipment, Assembly Materials, and assembly of optical components. This new Team is being formed to bring up all required packaging and assembly capabilities for a new U.S. based development and HVM factory, already announced by Global Foundries in the Northeast United States. In addition to assembly technologies, this Team will also need to add expertise in Package Design, Package Modeling (Mechanical, Thermal Electrical), and package physical characterization. Given the focus on Photonics, there is also a strong need for Design/Integration/assembly of Optical components and connectors.

It is expected that co-packaged optical packaging solutions will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters and 3D electrical interconnect solutions including Copper RX, Copper uPillar, and chip-on-wafer assembly.

Responsibilities:  

• Develop assembly technologies for Photonic Packaging, including both chip assembly and optical solutions.
• Assesses package assembly characterization data to ensure processes are feasible, robust, and a broad set of requirements - Manufacturability, Cost, Reliability, Performance.
• Drive Design and processes that enable integration of Electrical and Optical test solutions
• Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts.  
• Driving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.  
• Provides tools and complex analysis of quality issues and associated financial implications  
• Drives discipline and qualification robustness through a consistent global qualification process 
• Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:  
• Perform project management and data analysis  
• Identify and resolve process integration issues and related problems  
• Develop custom or derivative processes to meet customer needs 
• Support new designs with module characterization and design rule development   
• Work with cross function teams to resolve technical & yield concerns 
• Develop and improve test structures that enable fast and rigorous characterization of process             
• Drive CIP (Continuous improvement plans) to deliver organizational goals 
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs  

Required Qualifications: 

• MS, or PhD + 5 or more years of experience 
• Experienced packaging assembly development, bringing processes and products from development into production.
• Strong written and spoken English communication skills 

Preferred Qualifications:  

• Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem. 
• Experience completing failure analysis, design of experiments, & packaging process integration. 
• Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging. 
• Knowledge of assembly technology, equipment, and material roadmaps to enable future processes

Expected Salary Range

The exact Salary will be determined based on qualifications, experience and location.