Business Unit Description

NXP’s Technology & Operations organization plays an essential role in the company’s success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers.

Job Summary:

The Photolithography Process Engineer opportunity is in a high-volume semiconductor wafer manufacturing environment. The position requires ownership and responsibility for the control, development and optimization of Photolithography processes and equipment. Prior experience on ASML PAS & Twinscan XT platforms (both hardware & process troubleshooting) is a must-have requirement.

Primary Job Duties:

· Lead activities with engineering, production, device and support organizations in a high-volume semiconductor wafer manufacturing environment.

· Conduct startup / baselining activities on new scanner installations.

· Develop and lead projects to help optimize Quality (yield improvement & defect reduction), Delivery (MTBF, MTTR, qual optimizations, capacity qualifications, cycle time reductions), and Cost (process optimization, chemical usage qualification & consumption reduction).

· Participate in fab-to-fab standardization & benchmarking activities related to: tool-to-tool matching, scrap reduction, defect reduction, cost reduction, as well as throughput improvement projects.

· Develop processes for new technology / layer introductions.

· Maintain, upgrade and monitor wafer fabrication equipment in Photolithography.

· Provide innovative, real time, quick response and solutions to line issues to help maintain manufacturing requirements while ensuring the highest level of quality.

· Utilize logical and objective data analysis to establish and track metrics to meet department goals.

Additional candidate expectations:

· Self-motivated; able to take initiative.

· Ability to deal with multiple issues and shifting priorities.

· Ability to interact with multiple disciplines in a 7x24 manufacturing facility.

· Ability to train, mentor and lead junior engineers and experienced technicians.

· Ability to lead task force teams across departments and divisions.

· Ability to successfully plan, execute, analyze and deliver projects per schedule and on-time.

· Strong data analysis, troubleshooting, teamwork, and communication skills.

· Solid knowledge of SPC and FDC and their uses for troubleshooting and making improvements.

· Aptitude and desire to learn new skills.

· Six Sigma certification and/or use of LEAN improvement tools.

· Ability to thrive in a multi-cultural environment.

Job Qualifications:

· At least a Bachelor of Science degree in Engineering (Chemical, Electrical, Mechanical or Materials Science)

· Requires 5-10 years minimum of engineering experience in a 200mm/300mm high volume manufacturing environment, preferably in Photolithography.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.